Boxin · Hengzhen · Botrust
Precision Manufacturing・Powering the World
MIM
This component is a copper-based conductive and thermally conductive base produced via MIM (Metal Injection Molding). Made from a high‑conductivity copper alloy, its monolithic, modular structure delivers exceptional electrical and thermal conductivity along with robust structural integrity. It is primarily used in electronic devices and electrical systems as a conductor for current flow, a medium for heat transfer, or a mounting element, making it well suited for applications involving high currents and demanding thermal management requirements.
- Product Description
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I. Basic Product Information
- Product Name : MIM copper-based conductive/thermally conductive base (circuit/heat-dissipation connector)
- Manufacturing process Metal Injection Molding (MIM)
- Material : High-conductivity copper alloys (such as red copper and brass; other copper-based alloys can be customized)
- Core Use : As a conductive base, thermal bridge, or functional mounting platform in electronic devices and electrical systems, it facilitates high‑current conduction, heat dissipation, and component fixation, and is widely used in new‑energy equipment, home‑appliance control modules, and industrial electrical installations.
II. Structure and Process Details
- Appearance and Structural Features
- The assembly features an integrally molded, modular structure, with a large‑size rectangular plate serving as the primary electrical and thermal contact surface. This enables extensive conformal contact with external components, thereby reducing both contact resistance and thermal resistance.
- A positioning boss with a semicircular groove extends from the side, enabling quick assembly and alignment with shafts and cylindrical components, while also providing pre‑installed electrical and thermal conduction pathways, eliminating the need for additional welding or fasteners.
- The surface features a brushed finish, smooth and even with no burrs, allowing for direct subsequent surface treatments such as tin plating or nickel plating, thereby enhancing oxidation resistance and solderability.
- MIM Process Advantages Highlighted
- One‑step molding of complex structures: Multi‑feature components such as flat plates, locating bosses, and arcuate grooves eliminate the need for secondary machining, being directly formed in the mold. This delivers high dimensional accuracy, excellent part‑to‑part consistency, and seamless compatibility with automated assembly.
- Outstanding material performance: After sintering, the copper alloy exhibits high density and electrical and thermal conductivities comparable to those of pure copper, while also offering adequate structural strength, making it well suited for applications involving high currents and intensive heat dissipation.
- Strong surface‑state compatibility: It can be subjected to polishing, tin plating, nickel plating, and other treatments as required, enhancing oxidation resistance and corrosion resistance while optimizing weldability and assembly performance to meet diverse process requirements.
- Cost and Efficiency Advantages: Near-net-shape forming significantly reduces subsequent machining steps, achieves high material utilization, and is well-suited for mass production, thereby effectively lowering per-unit costs.
- Performance Features
- Excellent electrical and thermal conductivity: The large‑area planar structure effectively enhances the efficiency of current and heat transfer, reduces losses, and meets the operational requirements of high‑power devices.
- Structural stability and reliability: The one-piece molded structure features no welds, ensuring uniform stress distribution throughout. It can withstand thermal cycling and mechanical vibrations during equipment operation, making it resistant to contact failure and deformation over long-term use.
- Excellent corrosion resistance: The copper alloy material can be tailored through surface treatments to suit humid, dusty, and other demanding working environments; it is resistant to oxidation and rust, resulting in low maintenance costs.
- Wide customization and adaptability: The tablet dimensions, boss positions, arc‑groove sizes, and other parameters can be tailored to meet customer requirements, ensuring compatibility with the installation space, current‑carrying capacity, and thermal management needs of various devices.
III. Application Scenarios
It is widely used in applications such as current‑collecting bases for new‑energy battery packs, heat‑dissipating connectors for home appliance electronic control modules, conductive mounting brackets for industrial electrical equipment, and circuit‑connection components for precision instruments, making it particularly well suited to the electronics and electrical industries, where high demands are placed on a part’s electrical and thermal conductivity, dimensional accuracy, and batch‑to‑batch consistency.
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