Boxin · Hengzhen · Botrust
Precision Manufacturing・Powering the World
MIM
This component is a copper‑based, H‑shaped conductive/thermally conductive connector manufactured via MIM (Metal Injection Molding). Made from a high‑conductivity copper alloy, its monolithic “H”‑shaped structure delivers both exceptional mechanical strength and superior electrical and thermal conductivity. It is primarily used in electronic devices and electrical systems as a conductor for current flow, a medium for heat transfer, or an interconnect, making it well suited for applications with high current ratings and demanding thermal management requirements.
- Product Description
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I. Basic Product Information
- Product Name : MIM copper-based H-shaped conductive connector (thermal/ electrical interconnect)
- Manufacturing process Metal Injection Molding (MIM)
- Material : High-conductivity copper alloys (such as red copper and brass; other copper-based alloys can be customized)
- Core Use : As conductive connectors, thermal‑bridging components, or circuit busbars in electronic devices and electrical systems, they enable high‑current conduction, heat transfer, and circuit interconnection, and are widely used in new‑energy equipment, home‑appliance control modules, and industrial electrical apparatus.
II. Structure and Process Details
- Appearance and Structural Features
- The entire structure is integrally formed in an “H” shape, with two parallel plate-like sections that can be connected to separate conductive or heating components, while the central bridge facilitates cross‑connection and transfer of electrical current or thermal energy, eliminating the need for additional soldering or splicing.
- The surface is smooth and flat, with no burrs along the edges, enabling direct surface-to-surface contact with components, thereby reducing contact resistance and thermal resistance and enhancing electrical and thermal conductivity.
- The structure features a smooth transition, with no stress concentration points, and can withstand vibrations as well as thermal expansion and contraction stresses during equipment operation, remaining resistant to deformation and fracture over long-term use.
- MIM Process Advantages Are Evident
- One‑step forming of complex structures: The multi‑plane H‑shaped joint requires no secondary machining or welding; it is directly molded, offering high dimensional accuracy, excellent part‑to‑part consistency, and compatibility with automated assembly.
- Excellent material performance: After sintering, the copper alloy exhibits high density and electrical and thermal conductivity comparable to those of pure copper, while also maintaining adequate structural strength, making it well suited for applications involving high currents and intensive heat dissipation.
- Strong surface‑condition compatibility: Surface treatments such as tin plating and nickel plating can be applied as needed to enhance oxidation resistance and corrosion resistance, while also improving weldability and accommodating various assembly processes.
- Cost and Efficiency Advantages: Near-net-shape forming significantly reduces subsequent machining steps, achieves high material utilization, and is well-suited for mass production, thereby effectively lowering the per-unit cost.
- Performance Features
- Excellent electrical and thermal conductivity: The copper-based material inherently boasts high electrical and thermal conductivity, while the surface-contact design effectively reduces both contact resistance and thermal resistance, thereby enhancing the efficiency of current and heat transfer.
- Structural stability and reliability: The integrally molded structure features no welds, ensuring uniform stress distribution throughout. It can withstand thermal cycling and mechanical vibrations during equipment operation, making it resistant to contact failure and fracture even under prolonged use.
- Excellent corrosion resistance: The copper alloy material can be tailored through surface treatments to suit humid, dusty, and other demanding working environments; it is resistant to oxidation and rust, resulting in low maintenance costs.
- Wide customization and adaptability: The dimensions, thickness, contact area, and other parameters of the H‑shaped structure can be tailored to meet customer requirements, ensuring compatibility with various equipment’s installation space, current‑carrying capacity, and thermal‑management needs.
III. Application Scenarios
It is widely used in applications such as busbars for new‑energy battery packs, conductive connectors for home appliance control modules, thermal‑conductive bridge components in industrial electrical equipment, and circuit‑connection parts for precision instruments, making it particularly well suited to the electronics and electrical industries, where high demands are placed on a component’s electrical and thermal conductivity, dimensional accuracy, and batch‑to‑batch consistency.
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